Originally Posted by Tom (Atl)
Also - Does anyone know why he used a heat gun? I searched the entire guide and did not find this anywhere. What step is this in place of?
He is heating the whole board so all the solder joint reflow, somewhere around 400F. It's a trick to reflow solder joints on solder on processors but it's a careful balance in reflowing vs overheating. Search goggle on Xbox 360 red rings of death fix and all will be revealed. I did individual components and that worked too. Hope this helps.