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Originally Posted by Tom (Atl)
Also - Does anyone know why he used a heat gun? I searched the entire guide and did not find this anywhere. What step is this in place of?
Thanks!
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He is heating the whole board so all the solder joint reflow, somewhere around 400F. It's a trick to reflow solder joints on solder on processors but it's a careful balance in reflowing vs overheating. Search goggle on Xbox 360 red rings of death fix and all will be revealed. I did individual components and that worked too. Hope this helps.